IMEC developed a new "flexible" package for ICs

Recently, IMEC collaborated with Intec Laboratories of Ghent University to develop a thin and flexible package for ICs.

The two organizations called this cooperation project "Shift". Shift began on January 1, 2004 and is expected to be completed on December 31, 2008. Shift's total investment will be $14 million, of which $7.2 million will be funded by EU and Swiss authorities.

According to IMEC, the new package has a thickness of only 50 microns and is flexible enough to be used in high-end, multi-functional electronic systems. Chips using this type of packaging can be contained in soft boards, small pieces of textiles, and relatively soft displays.

This package has been shown through silicon wafers with a thickness of 20-30 microns. This package consists of two layers: a polyimide layer and a metal layer with a total thickness of 50 microns. The thickness of the polyimide layer is 20 microns and it is wrapped in a hard glass. The silicon wafer and the polyimide are bound with cyclobutane - the function is to fix the silicon wafer. The cyclobutane is pre-cured, so it can maintain its properties at high temperatures. Since the cyclobutane between the silicon wafer and the polyimide has no air between them, no further vacuum processing is required. After the silicon wafer was coated with polyimide, it was covered with a hard film with a thickness of 20 μm. IMEC said that the role of the hard film is through the dura mater, and the laser electromagnetic wave can come into contact with the opening of the silicon wafer. The second layer of the package consists of a titanium-tungsten-copper alloy, which has a smooth, hard surface that effectively protects the silicon wafer from damage.

Full name:
The full name of IMEC is the European research institute, that is, the European Institute.
The full name of ICs is Information Computer System Ltd, which is Information Computer Systems Co., Ltd.

Source: China Printing & Packaging Network