Effect of Analysis of Baking Process on the Press Resistance of Baking Plate

The baking version of the printing plate is performed after the PS plate is exposed, developed, and removed. In the baking process should pay particular attention to the following points:

(1) The cured layer of the baking plate firmly adheres to the plate surface, and it is difficult to remove it from the plate surface. Therefore, before the baking plate, the dirty spots on the surface must be removed, and the dirt removing agent must be removed with tap water after the baking. Rinse clean, otherwise, the remaining dirt and dissolved material will make the layout dirty.

(2) The amount of protective agent should not be too much, there will be traces of water flow too much, and serious traces are not easy to ink. Under normal circumstances, as long as the control after the wipe does not have water-like traces on it.

(3) The cloth used for the protection of the scour protectant should be made of skim gauze, so as not to contaminate the layout when rubbed with a dirty cloth, to prevent the fibers of the cotton yarn from falling off the surface of the plate, causing the surface of the plate to be dirty, and wash it with water after use. Clean and replace it in time.

(4) Baking temperature should be controlled at a constant temperature, and the temperature range should be controlled at 2 to 5°C. When the temperature of the roasting machine reaches the predetermined roasting plate temperature, give it a constant temperature for 5 minutes and then roast the plate, so that the roasting plate temperature can be fixed.

(5) The baking temperature and time should be determined according to the resin solidification point of the photosensitive layer of the PS plate. In general, baking at 230°C for 5 minutes and baking at 8 hours at 250°C, different types of PS plate baking Edition temperature and time are different. Too high baking temperature or too long time will cause carbonization of the photosensitive layer, deformation of the layout, affecting the printing plate and the accuracy of overprinting. The temperature is too low and the degree of curing is not enough, which can easily cause dot distortion and also affect the resistance to printing force.

(6) After taking out the baked printing plate, be sure to allow it to cool naturally. Do not use fan-blow or cold-water spray. Otherwise, the plate of the printing plate will suddenly suffer from cold and shrink unevenly at high temperatures, causing overprinting. Not allowed, it will make the base severe shrinkage deformation can not be used.

(7) When baking a plate, whether or not the baking machine can bake several plates at a time, it is best to individually bake them one by one to ensure the plate quality.

(8) For the second development of the baking plate, the cleaning solution should be selected according to the normal standard. The formulation of the cleaning solution used is the same as that of the PS plate, and also depends on the different conditions of the PS plate base surface treatment method.

(9) Since the protective agent contains emulsifiers, it should be completely removed after baking, otherwise printing will cause ink emulsification and reduce ink receptivity.

(10) The surface of the plate after baking is often yellowish, and if it is light red, it indicates that a trace of photosensitive layer still remains on the plate. If the light red color disappears after cleaning with developer, it will not cause dirt on the plate, otherwise it will cause the plate to be dirty. This plate cannot be printed on the machine.

(11) The regenerated PS plate cannot be baked because the thickness of the regenerated PS plate after the plate has been regenerated many times is less than 0.3 cm, making it difficult to bake a qualified plate.