Laser drilling machine

MicroVector UV Laser FPC Cutting Machine

Features:
Today's flexible printed circuit boards (FPCs) have increasingly complex shapes and shorter delivery times. Traditional flexible board processing technology uses machining methods to open cover film windows and processing shapes, which can no longer meet the requirements of the market: The first is because of the longer mold open cycle; the second is that the molds required for opening complex flexible plates must be more complex, and the cost is considerable for small and medium batch sizes; and the third is that the complex openings are due to the shape and size factors. Die processing becomes increasingly difficult. TopWin's MicroVector equipment uses high-power ultraviolet lasers to process flexible circuit boards, which are suitable for small batches and mass production, and have gained market recognition in terms of quality, price, and speed.
Laser cutting directly based on CAD data is more convenient and faster, and delivery time can be shortened significantly;
The use of galvanometer scanning and linear motor two-dimensional table joint movement method does not increase the processing difficulty due to complex shapes and path twists;
The MicroVector device uses vectors to describe the laser path, which is more smooth. The edge of the cover film cut by this laser system is neat, smooth, smooth and free of burrs. The burrs and glue after punching will be near the windows where the windows are inevitably machined by molds, etc. Such burrs and glues are difficult to remove after being laminated on the bonding pads, and will directly affect the subsequent Plating quality.
Flexible plate sample processing often results in the change of the cover film window due to the customer's need to modify the line and pad positions, and the conventional method requires the replacement or modification of the mold. With the MicroVector system, this problem can be solved because you only need to import the modified CAD data into MicroVector's software system, and you can easily and quickly process the cover film that you want to open the window pattern. It will be time and cost. For you to win market competition opportunities.
The MicroVector device integrates optical, electrical and mechanical high technology such as numerical control technology, laser technology, and software technology, and features advanced manufacturing technologies such as high flexibility, high precision, and high speed, enabling circuit board manufacturers to be technologically, economically, and time-sensitive. Upward and autonomous changes in the traditional processing and delivery methods of flexible panels.

Applications The MicroVector UV laser device can be used in a wide range of applications in flexible board production, including FPC profile cutting, contour cutting, drilling, film opening, and more.

Technical Parameters:
Laser: Q-switched semiconductor-pumped all-solid-state laser Laser material: Nd:YVO4
Laser wavelength: 355nm
Rated power: 7W@25KHz
Linear motor table positioning accuracy: +2μm
Linear Motor Stage Repeatability: +1μm
Linear motor table effective stroke: 304mmÑ…400mm
CCD automatic positioning accuracy: 7μm
Galvanometer working format: 40mmÑ…40mm
Resonator repeatability: +3μm
Data File: Gerber Standard Format